ETSP-TSD series are damper type 3 zone thermal shock test chambers, designed for thermal shock test of components or equipment, submitting them to rapid temperature changes.
Therefore they are suitable for quality control laboratories or in production plants for screening of components or equipments.
ETSP-TSD series allows users to carry out a wide range of tests necessary to determine thermal characteristics. It is possible to offer standard or customer-designed models.
- Rapid cooling with low noise level
- Low level of vibration
- Faster temperature recovery time
- Fast thermal response with continuous and linear control over the whole range
- Friendly, flexible, up-to date control and management systems
- Allows easy servicing and upgrades
| Temperature range | Hot zone Ambient ~ 200 ℃ Cold zone -75 ~ 10 ℃ |
|---|---|
| Temperature accuracy | Less than ± 0.3 ℃ |
| Temperature heat up rate | Ambient to 200 ℃ within 45 minutes |
| Temperature pull down rate | Ambient to -70 ℃ within 45 minutes |
| Temperature recovery time | 5 ~ 15 minutes |
| Microprocessor controller including self-diagnostics warning message function | |
| Model | Internal dimensions | External dimensions | Useful capatity |
|---|---|---|---|
| ETSP-TSD 50 | 300x300x300 (WxDxH) mm | 1370x1440x1955 (WxDxH) mm | 27 liters |
| ETSP-TSD 100 | 400x400x400 (WxDxH) mm | 1470x1540x2055 (WxDxH) mm | 64 liters |
| ETSP-TSD 150 | 500x500x500 (WxDxH) mm | 1570x1640x2155 (WxDxH) mm | 125 liters |
